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  1/6 preliminary data august 2001 STQ1HNC60 n-channel 600v - 7 w - 0.4a to-92 powermesh?ii mosfet n typical r ds (on) = 7 w n extremely high dv/dt capability n 100% avalanche tested n new high voltage benchmark n gate charge minimized description using the latest high voltage mesh overlay?ii process, stmicroelectronics has designed an ad- vanced family of power mosfets with outstanding performances. the new patent pending strip layout coupled with the companys proprietary edge termi- nation structure, gives the lowest rds(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switching characteris- tics. applications n switch mode low power suppies (smps) n cfl absolute maximum ratings (?)pulse width limited by safe operating area type v dss r ds(on) i d STQ1HNC60 600 v < 8 w 0.4 a symbol parameter value unit v ds drain-source voltage (v gs = 0) 600 v v dgr drain-gate voltage (r gs = 20 k w ) 600 v v gs gate- source voltage 30 v i d drain current (continuos) at t c = 25c 0.4 a i d drain current (continuos) at t c = 100c 0.25 a i dm ( l ) drain current (pulsed) 1.6 a p tot total dissipation at t c = 25c 3.5 w derating factor 0.028 w/c dv/dt(1) peak diode recovery voltage slope 3.5 v/ns t stg storage temperature C65 to 150 c t j max. operating junction temperature 150 c (1)i sd 0.4 a, di/dt 100a/s, v dd v (br)dss , t j t jmax. to-92 internal schematic diagram
STQ1HNC60 2/6 thermal data avalanche characteristics electrical characteristics (tcase = 25 c unless otherwise specified) off on (1) dynamic rthj-case rthj-amb t l thermal resistance junction-case thermal resistance junction-ambient max (surface mounted) maximum lead temperature for soldering purpose 35.7 60 300 c/w c/w c symbol parameter max value unit i ar avalanche current, repetitive or not-repetitive (pulse width limited by t j max) 0.4 a e as single pulse avalanche energy (starting t j = 25 c, i d = i ar , v dd = 50 v) 100 mj symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage i d = 250 a, v gs = 0 600 v i dss zero gate voltage drain current (v gs = 0) v ds = max rating 1a v ds = max rating, t c = 125 c 50 a i gss gate-body leakage current (v ds = 0) v gs = 30v 100 na symbol parameter test conditions min. typ. max. unit v gs(th) gate threshold voltage v ds = v gs , i d = 250 a 234v r ds(on) static drain-source on resistance v gs = 10v, i d = 0.4 a 78 w symbol parameter test conditions min. typ. max. unit g fs forward transconductance v ds > i d(on) x r ds(on)max, i d = 0.4 a 1.25 s c iss input capacitance v ds = 25v, f = 1 mhz, v gs = 0 160 pf c oss output capacitance 26 pf c rss reverse transfer capacitance 3.8 pf
3/6 STQ1HNC60 electrical characteristics (continued) switching on switching off source drain diode note: 1. pulsed: pulse duration = 300 s, duty cycle 1.5 %. 2. pulse width limited by safe operating area. symbol parameter test conditions min. typ. max. unit t d(on) turn-on delay time rise time v dd = 300v, i d = 0.7 a r g = 4.7 w , v gs = 10v (see test circuit, figure 3) 8ns t r 8ns q g total gate charge v dd = 480v, i d = 1.4 a, v gs = 10v, r g =4.7 w 8.5 11.5 nc q gs gate-source charge 2.8 nc q gd gate-drain charge 2.8 nc symbol parameter test conditions min. typ. max. unit t r(voff) off-voltage rise time v dd = 480 v, i d = 1.4 a, r g = 4.7 w, v gs = 10v (see test circuit, figure 5) 25 ns t f fall time 9 ns t c cross-over time 34 ns symbol parameter test conditions min. typ. max. unit i sd source-drain current 0.4 a i sdm (2) source-drain current (pulsed) 1.6 a v sd (1) forward on voltage i sd = 0.4 a, v gs = 0 1.6 v t rr reverse recovery time i sd = 1.4 a, di/dt = 100a/s, v dd = 100v, t j = 150c (see test circuit, figure 5) 500 ns q rr reverse recovery charge 950 m c i rrm reverse recovery current 3.8 a
STQ1HNC60 4/6 fig. 5: test circuit for inductive load switching and diode recovery times fig. 4: gate charge test circuit fig. 2: unclamped inductive waveform fig. 1: unclamped inductive load test circuit fig. 3: switching times test circuit for resistive load
5/6 STQ1HNC60 dim. mm inch min. typ. max. min. typ. max. a 4.58 5.33 0.180 0.210 b 4.45 5.2 0.175 0.204 c 3.2 4.2 0.126 0.165 d 12.7 0.500 e1.27 0.050 f 0.4 0.51 0.016 0.020 g0.35 0.14 to-92 mechanical data
STQ1HNC60 6/6 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsib ility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectroni cs. specifi cation mentio ned in this publication are subject to change without notice. this publication supersedes and replaces all in formation previou sly supplied. stmicroe lectron ics products are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectron ics. the st logo is a trademark of stmicroelectronics ? 2000 stmicroelectronics C pr inted in italy C all rights reserved stmicroelectronics group of companies australia - brazil - china - finland - france - germany - hong kong - india - italy - japan - malay sia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - u.s.a. http://www.st.com


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